HUAWEI Shares New Chip Technology Plan

HUAWEI shared a new chip idea at the 2026 IEEE ISCAS event in Shanghai. The company said the new plan may help make faster and stronger computer chips in the future.

The new system is called the Tau Scaling Law. HUAWEI said it focuses on making signals move faster inside chips. This is different from older methods that mainly tried to make parts smaller.

A HUAWEI leader named He Tingbo spoke at the event. She said the chip industry now faces big problems because older chip designs are reaching their limits. Many companies are finding it harder and more costly to improve chip power with old methods.

The company also shared a new design called Logic Folding. HUAWEI said this design can help chips work faster and use power in a better way. The company explained that the design shortens the path signals travel inside chips. This may help devices run more smoothly and quickly.

Another new tool called Unified Bus may help computers share data more quickly. HUAWEI said this could improve large AI systems and high speed computing.

HUAWEI also said it has already made 381 chips using ideas from the Tau Scaling Law. These chips are used in phones AI systems cloud services and other technology products across many industries.

The company said future Kirin chips planned for late 2026 will use the new Logic Folding design for the first time. HUAWEI believes this will greatly improve chip speed and performance.

The company also shared a future goal. By 2031 HUAWEI hopes its advanced chips will reach transistor density similar to very small 1.4 nanometer chip technology.

Experts say the world chip industry is looking for new ways to improve computers because older chip methods are slowing down. Many tech companies are now working on new ideas for AI smart devices and cloud computing.

HUAWEI said it wants to work with scientists engineers and other companies around the world to help build the future of chip technology.